测试与最后工序之融合

目前,半导体工业正以飞快速度不断发展变化。面对成本压力和新封装技术,制造业和设备供货商们在设备能力、工艺和自动控制方面持续不断地加以更新和改进。在测试与最后工序领域中,成功的自动化解决方案是使测试与最后工序相结合,即从根本上转变它的设计形式而大幅度提高效率。它不仅包括大量已封装好的独立组件及高平行性的测试系统,也包括合并高速的最后工序系统。

Fusion of Test and Finish

The semiconductor industry is changing at a rapid speed. Cost pressures and new packaging technologies are driving manufactures and equipment vendors to constantly innovate in terms of equipment capabilities; process improvements and automation. In the area of test and finishing, successful automation solution, which combines "Test and Finish" has radically transforms its landscape with dramatic increase in efficiency. This involves not only a massive, highly parallel testing system but also the union of a high speed finishing system.