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硬磁盘基片研磨的运动分析
引用本文:冯连东,吕玉山,哈兰涛. 硬磁盘基片研磨的运动分析[J]. 沈阳理工大学学报, 2004, 23(4): 14-18
作者姓名:冯连东  吕玉山  哈兰涛
作者单位:1. 沈阳理工大学,机械工程学院,辽宁,沈阳,110168
2. 上海工程技术大学
摘    要:分析了在硬磁盘基片研磨过程中的运动状况.建立了行星式研磨机的运动学模型.基于这个模型利用蒙特卡罗法分别对磨料切削轨迹、切痕方向的变化、基片表面的瞬态速度场和平均相对速度场等进行了数值模拟,并根据模拟结果研究讨论了在研磨中运动参量对基片表面的材料去除率(MRR)的分布均匀性、表面纹理和其它的质量因素等的影响规律.

关 键 词:硬盘 基片 运动分析 去除率 磁头 计算机设备
文章编号:1003-1251(2004)04-0014-05
修稿时间:2004-09-17

Analysis on the Kinematices of the Lapping of Hard Magnetic Disk Substrate
FENG Lian-dong,LU Yu-shan,HA Lan-tao. Analysis on the Kinematices of the Lapping of Hard Magnetic Disk Substrate[J]. Transactions of Shenyang Ligong University, 2004, 23(4): 14-18
Authors:FENG Lian-dong  LU Yu-shan  HA Lan-tao
Affiliation:FENG Lian-dong~1,LU Yu-shan~1,HA Lan-tao~2
Abstract:The kinematics of the lapping of hard magnetic disk substrate is analysed.A kinematic model of the planet lapping machine is developed.On the basis of the model the track of abrasive grains, the change of the direction of the velocity , the field of the transient relative velocity and average relative velocity on the surface of the substrate are numerically simulated respectively by the method of Monte Carlo . According to the results of the simulation, the effects of the kinematics during the lapping on the non-uniformity of material remove rate(MRR) across the surface of the substrate,the texture of the surface and other factors about quality are discussed and researched.
Keywords:lapping  hard magnetic disk substrate  material remove rate  uniformity
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