| 镀Pd Cu线键合工艺中Pd行为研究 |
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| 引用本文： | 张滨海,钱开友,王德峻,从羽奇,赵健,范象泉,王家楫.镀Pd Cu线键合工艺中Pd行为研究[J].半导体技术,2010,35(6):564-568. |
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| 作者姓名： | 张滨海 钱开友 王德峻 从羽奇 赵健 范象泉 王家楫 |
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| 作者单位： | 复旦大学材料科学系,上海,200433;日月光封装测试有限公司,上海,201203 |
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| 摘 要： | 由于Cu线热导率高、电性能好、成本低,将逐渐代替传统Au线应用于IC封装.但Cu线键合也存在Cu材料本身固有特性上的局限:易氧化、硬度高及应变强度等.表面镀Pd Cu线材料的应用则提供了一种防止Cu氧化的解决方案.然而,Cu线表面的Pd层很可能会参与到键合界面形成的行为中,带来新的问题,影响到Cu线键合的强度和可靠性.对镀Pd Cu线键合工艺中Pd的行为进行了系统的研究,使用了SEM,EDS等分析手段对cu线、烧结Cu球(FAB)、键合界面等处Pd的分布状况进行了检测,结果证明Pd的空间分布随着键合工艺的进行发生了很大的变化,同时还对产生Pd分布变化的原因进行了分析和讨论.
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| 关 键 词： | 封装 铜线键合 镀钯层 金属间化合物 |
Behaviors of Palladium in Palladium Coated Copper Wire Bonding Process |
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| Zhang Binhai,Qian Kaiyou,Wang Dejun,Cong Yuqi,Zhao Jian,Fan Xiangquan,Wang Jiaji.Behaviors of Palladium in Palladium Coated Copper Wire Bonding Process[J].Semiconductor Technology,2010,35(6):564-568. |
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| Authors: | Zhang Binhai Qian Kaiyou Wang Dejun Cong Yuqi Zhao Jian Fan Xiangquan Wang Jiaji |
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| Affiliation: | Zhang Binhai1,Qian Kaiyou2,Wang Dejun2,Cong Yuqi2,Zhao Jian2,Fan Xiangquan1,Wang Jiaji1(1.Department of Material Science,Fudan University,Shanghai 200433,China,2.ASE Assembly & Test(Shanghai) Limited,Shanghai 201203,China) |
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| Abstract: | Because of its high thermal conductivity,great electrical property and low cost,copper wire is considered to replace the conventional gold wire in IC assembly processes.However,copper wire bonding also has its limitations.Copper oxidation,high hardness and yield strength are the main disadvantages that manufacturers concerns most.The application of copper wire coated with Pd is a solution to prevent copper oxidation during the bonding process.Nevertheless,Pd coated copper wire brings in new possible influen... |
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| Keywords: | packaging copper wire bonding Pd coating intermetallic compound(IMC) |
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