Kinetics of copper dissolution and deposition in aqueous sulphate solution

Galvanostatic single-pulse, rotating-disc and chronopotentiometric measurements on etched polycrystalline copper electrodes in semimolar mixed solutions of CuSO₄, MgSO₄ and H₂SO₄ at 25°C have yielded kinetic parameters and specific rate data for either of the two consecutive charge-transfer steps of the Cu(I)/Cu(II) electrode. The ion-transfer step Cu/Cu(I), but not the electron-transfer step Cu/Cu(II), depends on a surface factor for crystal growth and demolition. Some information on this factor is obtained. Comparisons are made to the solid Ni/Ni(II) electrode and to the liquid Cu(Hg)/Cu(II) electrode.