| 比较几种大功率LED封装基板材料 |
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| 引用本文： | 赵赞良,唐政维,蔡雪梅,李秋俊,张宪力.比较几种大功率LED封装基板材料[J].装备制造技术,2006(4):81-84. |
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| 作者姓名： | 赵赞良 唐政维 蔡雪梅 李秋俊 张宪力 |
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| 作者单位： | 重庆邮电大学光电工程学院,重庆,400065 |
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| 摘 要： | 研究人员往往通过改变热沉材料、改进封装结构和散热结构等方式来解决大功率LED的散热问题。本文采用简化的等效封装模型,对几种基板材料的等效热阻进行计算,用计算结果来进行比较,从而选择出更为合适的可用于封装大功率LED的基板材料。
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| 关 键 词： | 大功率LED 基板材料 简化等效模型 散热 |
| 修稿时间： | 2006年9月1日 |
Comparing Some Packaging Board Materials for Large Power LED |
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| Authors: | ZHAO Zan-liang TANG Zheng-wei CAI Xue-mei LI Qiu-jun ZHANG Xian-li |
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| Abstract: | Usually,the heat of large power LED is eliminated by changing heat sink materials,improving packaging and heat dissipation structures.In the paper,the simplified equivalent model is established to calculate the equivalent thermal resistance of several board materials,and by comparing the calculation results,the even more suitable packaging board material is found out. |
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| Keywords: | Large power LED Board material Simplified equivalent model Heat dissipation |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
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