| CBGA植球在线质量检测与控制技术 |
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| 引用本文： | 杨兵,丁荣峥,唐桃扣.CBGA植球在线质量检测与控制技术[J].电子与封装,2009,9(3):6-10,31. |
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| 作者姓名： | 杨兵 丁荣峥 唐桃扣 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏,无锡,214035 |
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| 摘 要： | 文章主要阐述了CBGA（陶瓷焊球阵列封装）植球过程中焊球、锡膏的选择,基板上焊盘镀金层厚度的控制,植球网板与印刷网板的制作,回流工艺的设定,焊球与陶瓷基板黏附质量的无损检测和破坏性检测方法。介绍了CBGA产品植球过程中的在线质量检测与控制,对提高CBGA产品的植球质量、成品率、一致性以及剔除焊球互连中的缺陷,提高产品的可靠性有帮助。
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| 关 键 词： | 陶瓷封装 球栅阵列封装 植球焊球抗剪 焊球抗拉 在线检测 |
Quality Inspection and Control Technology of CBGA Solder Ball On-line |
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| YANG Bing,DING Rong-zheng,TANG Tao-kou.Quality Inspection and Control Technology of CBGA Solder Ball On-line[J].Electronics & Packaging,2009,9(3):6-10,31. |
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| Authors: | YANG Bing DING Rong-zheng TANG Tao-kou |
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| Affiliation: | YANG Bing,DING Rong-zheng,TANG Tao-kou (Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214035,China) |
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| Abstract: | This article basically describes the selection of solder ball and solder paste in the process of CBGA ball placement,controlling thickness of pad gold-plating layer on the substrate,production of ball placement stencil and printing stencil,setting of reflowing process,non-destructive testing and destructive detection methods for solder ball and gold-plated pad adhesion quality. It introduces CBGA solder ball quality inspection and control on-line.It is helpful to the provision of CBGA placing solder ball qu... |
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| Keywords: | ceramic package ball grid array package solder ball shear solder ball pull inspection on-line |
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