| 挠性覆铜板用环氧胶粘剂的咪唑固化促进剂的优选研究 |
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| 引用本文： | 刘生鹏,茹敬宏,盖其良.挠性覆铜板用环氧胶粘剂的咪唑固化促进剂的优选研究[J].绝缘材料,2007,40(3):15-17,21. |
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| 作者姓名： | 刘生鹏 茹敬宏 盖其良 |
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| 作者单位： | 广东生益科技股份有限公司,广东,东莞,523039;广东生益科技股份有限公司,广东,东莞,523039;广东生益科技股份有限公司,广东,东莞,523039 |
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| 基金项目： | 东莞市科技计划“环保型挠性覆铜板”项目 |
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| 摘 要： | 分别采用2-乙基-4-甲基咪唑(2E4MZ)、1-氰乙基-2-乙基-4-甲基咪唑(2E4MZ-CN)、2-十一烷基咪唑(C11Z)、1-氰乙基-2-十一烷基咪唑(C11Z-CN)和2-十七烷基咪唑(C17Z)为促进剂,以环氧树脂(EP)/二氨基二苯砜(DDS)/丁腈橡胶(CTBN)为基本体系,制备了挠性覆铜板(FCCL)用胶粘剂。研究了各树脂体系的固化反应性和动态力学性能,并对比研究了FCCL的基本性能,确定该体系最佳促进剂为2E4MZ-CN。
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| 关 键 词： | 促进剂 咪唑 环氧树脂 挠性覆铜板 |
| 文章编号： | 1009-9239（2007）03-0015-04 |
| 修稿时间： | 2007-03-202007-04-24 |
The Optimization of Imidazole Curing Accelerants of Epoxy Adhesive for Flexible Copper Clad Laminate |
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| LIU Sheng-peng,RU Jing-hong,GAI Qi-liang.The Optimization of Imidazole Curing Accelerants of Epoxy Adhesive for Flexible Copper Clad Laminate[J].Insulating Materials,2007,40(3):15-17,21. |
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| Authors: | LIU Sheng-peng RU Jing-hong GAI Qi-liang |
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| Affiliation: | Guangdong Shengyi Sci. Tech Co., LTD., Dongguan 523039, China |
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| Abstract: | On the basis of epoxy resin(EP)/4,4'-Diaminodiphenyl sulfone(DDS) / carboxyl-terminated acrlonitrile-butadiene rubber(CTBN) system,five imidazole accelerants were used to prepare the adhesive for flexible copper clad laminate(FCCL),including 2-ethyl-4-methylimidazole(2E4MZ),1-cyanoethyl-2-ethyl-4-methylimidazole(2E4MZ-CN),2-undecylimidazole(C11Z),2-heptadecylimidazole(C17Z) and 1-cyanoethyl-2-undecylimidazole(C11Z-CN).The curing reactivity and the dynamic mechanical performance were studied using differectial scanning calorimetry(DSC) and Dynamic Mechanical Analysis(DMA) respectively,meanwhile the FCCL was prepared and analysed.In view of these factors,2E4MZ-CN is considered to be the best accelerant. |
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| Keywords: | accelerant imidazole epoxy resin flexible copper clad laminate |
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