Soft Core/Shell Packages for Stretchable Electronics |
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| Authors: | Chi Hwan Lee Yinji Ma Kyung‐In Jang Anthony Banks Taisong Pan Xue Feng Jae Soon Kim Daeshik Kang Milan S. Raj Bryan L. McGrane Briana Morey Xianyan Wang Roozbeh Ghaffari Yonggang Huang John A. Rogers |
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| Affiliation: | 1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana‐Champaign, Urbana, IL, USA;2. Department of Civil and Environmental Engineering and Mechanical Engineer, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL, USA;3. Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing, China;4. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, China;5. Department of Chemistry, University of Illinois at Urbana‐Champaign, Urbana, IL, USA;6. MC10, Inc., Cambridge, MA, USA;7. Department of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL, USA;8. Department of Materials Science and Engineering, Chemistry, Mechanical Science and Engineering, Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials, Research Laboratory, University of Illinois at Urbana‐Champaign, Urbana, IL, USA |
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| Abstract: | This paper presents materials and core/shell architectures that provide optimized mechanical properties in packages for stretchable electronic systems. Detailed experimental and theoretical studies quantitatively connect the geometries and elastic properties of the constituent materials to the overall mechanical responses of the integrated systems, with a focus on interfacial stresses, effective modulus, and maximum extent of elongation. Specific results include core/shell designs that lead to peak values of the shear and normal stresses on the skin that remain less than 10 kPa even for applied strains of up to 20%, thereby inducing minimal somatosensory perception of the device on the human skin. Additional, strain‐limiting mesh structures embedded in the shell improve mechanical robustness by protecting the active components from strains that would otherwise exceed the fracture point. Demonstrations in precommercial stretchable electronic systems illustrate the utility of these concepts. |
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| Keywords: | core/shell package epidermal systems stretchable electronics |
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