Miniaturized Flexible Electronic Systems with Wireless Power and Near‐Field Communication Capabilities |
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| Authors: | Jeonghyun Kim Anthony Banks Zhaoqian Xie Seung Yun Heo Philipp Gutruf Jung Woo Lee Sheng Xu Kyung‐In Jang Fei Liu Gregory Brown Junghyun Choi Joo Hyun Kim Xue Feng Yonggang Huang Ungyu Paik John A Rogers |
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| Affiliation: | 1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL, USA;2. Department of Materials Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul, Republic of Korea;3. Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, IL, USA;4. AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing, China;5. Functional Materials and Microsystems Research Group, School of Electrical and Computer Engineering, RMIT University, Melbourne, VIC, Australia |
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| Abstract: | A class of thin, lightweight, flexible, near‐field communication (NFC) devices with ultraminiaturized format is introduced, and systematic investigations of the mechanics, radio frequency characteristics, and materials aspects associated with their optimized construction are presented. These systems allow advantages in mechanical strength, placement versatility, and minimized interfacial stresses compared to other NFC technologies and wearable electronics. Detailed experimental studies and theoretical modeling of the mechanical and electromagnetic properties of these systems establish understanding of the key design considerations. These concepts can apply to many other types of wireless communication systems including biosensors and electronic implants. |
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| Keywords: | epidermal electronics wearable electronics wireless communication |
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