Investigating the role of key ingredients on cathodic delamination resistance of high-build pigmented epoxy coatings

Organic coatings applied on cathodically protected metallic structures must have good resistance to cathodic delamination or disbonding (CD). Both environmental conditions and coating composition influence the CD resistance. In the present study, the effect of types of epoxy resin, curing agents and their mixing ratio on cathodic delamination rate was studied in a high-build pigmented coating. Furthermore, the influence of platey fillers on CD resistance was also studied. In order to bring out correlations, if any, between adhesion and CD resistance, pull-off adhesion strengths (both dry and wet) of these coatings were also measured. Fairly good correlation was found between residual (wet) pull-off adhesion strength and CD resistance. When tested at 60 and 90°C, all the coatings under investigation showed chalking. Among the coatings under investigation, the one based on Bisphenol F epoxy and modified cycloaliphatic amine adduct exhibited excellent CD resistance.