| Synthesis and properties of nanocrystalline nonferrous metals prepared by flow-levitation-molding method |
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| 引用本文： | 刘伟 杨天足 楚广 罗江山 唐永建. Synthesis and properties of nanocrystalline nonferrous metals prepared by flow-levitation-molding method[J]. 中国有色金属学会会刊, 2007, 17(6): 1347-1351. DOI: 10.1016/S1003-6326(07)60275-1 |
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| 作者姓名： | 刘伟 杨天足 楚广 罗江山 唐永建 |
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| 作者单位： | [1]School of Metallurgical Science and Engineering, Central South University, Changsha 410083, China; [2]Institute of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China |
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| 摘 要： | Nanocrystalline nonferrous metals （Cu, A1, and Ag） were synthesized by flow-levitation-molding method. The microstructure of the as-prepared nanocrystalline metals was characterized by XRD and FESEM. The microhardness and electrical resistivity were tested by the HMV-2 type Microhardness Tester and 6157 type Electrometer, respectively. The synthesis process was also studied. The results show that the spheriform particles in nanocrystalline metals have average grain size of 20-30 nm. The relative density of nanocrystalline Cu, A1, and Ag are 95.1%, 98.1% and 98.3%, respectively. The microhardness of nanocrystalline Cu, Al and Ag are 2.01, 2.11 and 1.26 GPa respectively, which are larger than those of their coarse-grained counterparts by the factor of 4.5, 14, and 2.5, respectively. The electrical resistivity of nanocrystalline Cu at room temperature is 1.5× 10^-7Ω.m, which is higher than coarse-grained Cu by a factor of 7.5. The pressure is the predominant factor influencing the density of the as-prepared nanocrystalline nonferrous metals.
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| 关 键 词： | 纳米晶体蛋白 非铁材料 密度 显微硬度 |
| 收稿时间： | 2007-07-15 |
| 修稿时间： | 2007-07-15 |
Synthesis and properties of nanocrystalline nonferrous metals prepared by flow-levitation-molding method |
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| Wei LIU, Tian-zu YANG, Guang CHU, Jiang-shan LUO,Yong-jian TANG. Synthesis and properties of nanocrystalline nonferrous metals prepared by flow-levitation-molding method[J]. Transactions of Nonferrous Metals Society of China, 2007, 17(6): 1347-1351. DOI: 10.1016/S1003-6326(07)60275-1 |
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| Authors: | Wei LIU Tian-zu YANG Guang CHU Jiang-shan LUO Yong-jian TANG |
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| Affiliation: | 1. School of Metallurgical Science and Engineering, Central South University, Changsha 410083, China; 2. Institute of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China |
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| Abstract: | Nanocrystalline nonferrous metals (Cu, Al, and Ag) were synthesized by flow-levitation-molding method. The microstructure of the as-prepared nanocrystalline metals was characterized by XRD and FESEM. The microhardness and electrical resistivity were tested by the HMV-2 type Microhardness Tester and 6157 type Electrometer, respectively. The synthesis process was also studied. The results show that the spheriform particles in nanocrystalline metals have average grain size of 20–30 nm. The relative density of nanocrystalline Cu, Al, and Ag are 95.1%, 98.1% and 98.3%, respectively. The microhardness of nanocrystalline Cu, Al and Ag are 2.01, 2.11 and 1.26 GPa respectively, which are larger than those of their coarse-grained counterparts by the factor of 4.5, 14, and 2.5, respectively. The electrical resistivity of nanocrystalline Cu at room temperature is 1.5 × 10−7 Ωm, which is higher than coarse-grained Cu by a factor of 7.5. The pressure is the predominant factor influencing the density of the as-prepared nanocrystalline nonferrous metals. |
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| Keywords: | nanocrystalline nonferrous metals flow-levitation-molding density microhardness electrical resistivity |
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