高速锯切单晶硅的锯切力和锯缝崩边研究

探讨在单晶硅的高速精密锯切中,锯切用量与锯切崩边幅度大小之间的关系。通过使用金刚石薄锯片对单晶硅进行高速锯切,测量和分析不同参数下的锯切力,并结合锯切力比来分析金刚石锯片对单晶硅的锯切中力与崩边相互联系的特征。结果表明:在高速锯切单晶硅过程中,锯切深度、进给速度增大都能引起锯切力与力比的增大,也造成了单晶硅崩边情况更加严重。但是转速的提高则可以使锯切力大幅降低,并有效抑制加工过程中沟槽侧面的崩边问题。锯切深度与进给速度的增加引起锯切力增大时使单晶硅材料更加倾向于脆性断裂而被去除,但是提高转速降低锯切力后可使单晶硅渐转化为塑性去除,有效提高了加工产品质量。

Study on Edge Chipping in High-speed Cutting of Monocrystalline Silicon

The relationship between cutting data and the magnitude of edge chipping in the high- speed precision cutting of monocrystalline silicon is explored. By using thin diamond saw blade for high- speed sawing to silicon,the sawing force with different parameters in cutting process is measured and analyzed and combined with force ratio of diamond saw blade sawing silicon to analysis the interaction characteristic of the cutting force with edge chipping. The results show that the increase of cutting depth and feed rate can cause cutting force and force ratio increased,and the monocrystalline silicon edge chipping situation is also more serious in the high- speed cutting process. The increase of rotational speed can reduce cutting forces significantly and effectively suppress the edge chipping on the trench side in processing. The cutting force increasing with the increase of cutting depth and feed rate is more prone to brittle fracture removed of silicon materials. The speed increasing and cutting force reducing will make monocrystalline silicon gradually to transform into plastic removal and improve the quality of processed product.