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2D-C/SiC高速深磨磨削特性及去除机制
引用本文:刘杰,李海滨,张小彦,洪智亮,何宗倍,张毅,刘小瀛. 2D-C/SiC高速深磨磨削特性及去除机制[J]. 复合材料学报, 2012, 29(4): 113-118
作者姓名:刘杰  李海滨  张小彦  洪智亮  何宗倍  张毅  刘小瀛
作者单位:1. 西北工业大学 现代设计与集成制造技术教育部重点实验室, 西安 710072;2. 西北工业大学 超高温结构复合材料科技重点实验室, 西安 710072;3. 西安鑫垚陶瓷复合材料有限公司, 西安 710089
摘    要:采用树脂结合剂金刚石砂轮, 通过对2D-C/SiC复合材料高速深磨磨削加工, 并对磨削表面形貌和亚表面损伤进行了观察。提出了2D-C/SiC摩擦层(表面)的磨削力理论公式, 讨论了磨削加工用量对磨削力和磨削力比的影响。实验结果表明, 2D-C/SiC复合材料的高速深磨材料去除机制与其自身的微观结构相关, 既不同于塑性材料, 也不同于普通脆性材料, 而是以脆性断裂去除为主。

关 键 词:高速深磨  C/SiC  磨削力  磨削损伤  去除机制  
收稿时间:2012-01-04

Investigation of grinding characteristics and removal mechanisms of 2D-C/SiC in high speed deep grinding
LIU Jie,LI Haibin,ZHANG Xiaoyan,HONG Zhiliang,HE Zongbei,ZHANG Yi,LIU Xiaoying. Investigation of grinding characteristics and removal mechanisms of 2D-C/SiC in high speed deep grinding[J]. Acta Materiae Compositae Sinica, 2012, 29(4): 113-118
Authors:LIU Jie  LI Haibin  ZHANG Xiaoyan  HONG Zhiliang  HE Zongbei  ZHANG Yi  LIU Xiaoying
Affiliation:1. The Key Laboratory of Contemporary Design and Integrated Manufacture, Ministry of Education, Northwest Polytechnical University, Xi’an 710072, China;2. National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi’an 710072, China;3. Xi’an Golden-mountain Ceremic Composites Co.Ltd., Xi’an 710089, China
Abstract:The grinding experiments were conducted on 2D-C/SiC composites by using resin bond diamond wheel in this work.The ground surface/subsurface damages were observed.The theory expression of grinding force for the friction layer(surface) of 2D-C/SiC was proposed,and the effect of grinding machining process amount on grinding force and force ratio was also discussed.The result indicates that the removal mechanisms involved in the grinding process for 2D-C/SiC composites are dominated by their brittleness fractures and related to their microstructures,which are different from those of ordinary plastic and brittle materials.
Keywords:high speed deep grinding  C/SiC  grinding force  grinding damage  removal mechanism
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