| 现代微光电子封装中的倒装焊技术 |
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| 引用本文： | 裴为华,邓晖,陈弘达.现代微光电子封装中的倒装焊技术[J].微纳电子技术,2003(Z1). |
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| 作者姓名： | 裴为华 邓晖 陈弘达 |
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| 作者单位： | 中国科学院半导体研究所集成光电子学国家重点实验室 北京100083
(裴为华，邓晖)，中国科学院半导体研究所集成光电子学国家重点实验室 北京100083(陈弘达) |
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| 摘 要： | 结合我们设计制作的倒装焊光电子器件—智能像素面阵 ,对倒装焊的工艺过程作了简要的介绍。该面阵采用铟做凸点材料 ,制作了输入输出数达 6 4× 6 4的凸点电极阵列 ,并采用回流焊的方式 ,将光电调制器面阵与对应的处理电路芯片对准后加热回流实现焊接 ,形成输入输出引线间距只有 80 μm的面阵器件
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| 关 键 词： | 光电子集成 倒装焊 凸点 |
Flip chip bonding technology used in modern micro-photoelectron package |
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| PEI Wei hua,DENG Hui,CHEN Hong da.Flip chip bonding technology used in modern micro-photoelectron package[J].Micronanoelectronic Technology,2003(Z1). |
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| Authors: | PEI Wei hua DENG Hui CHEN Hong da |
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| Abstract: | The flip chip bonding process in making our photoelecton device (smart pixels) was described, and flip chip bonding technique was introduced briefly. In was used to make the bonding bumps, and a 64×64 bump array was fabricated. After the photo electron modulator array and corresponding IC were aligned in a special instrument which could realize micron precision, the two chips were heated and the bumps reflow and the soldering was sealed, the pitch is 80 microns. |
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| Keywords: | photoelectron integration flip chip bonding bump |
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