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Microstructure analysis of Ag films deposited by low-voltage sputtering
Authors:Kazuhiro Kato  Hideo OmotoAtsushi Takamatsu
Affiliation:
  • a Glass Research Center, Central Glass Co. Ltd., 1510 Ohkuchi-cho, Matsusaka-city, Mie Prefecture, 515-0001, Japan
  • b Glass Business Planning and Development Department, Central Glass Co. Ltd., 3-7-1 Kandanishiki-cho, Chiyoda-ku, Tokyo, 101-0054, Japan
  • Abstract:The microstructure of Ag films was investigated as a function of the cathode voltage during sputter deposition. It was found that the resistivity of the Ag films decreased when the Ag film was deposited at low cathode voltage using a magnetron cathode with high-magnetic flux density. X-ray diffraction measurement revealed that the Ag films deposited at low cathode voltages exhibited higher crystallization degree and larger crystallites. Besides, it was confirmed from glancing incident X-ray reflectivity measurement that the density of the Ag films increased with decreasing in the cathode voltage. It can be concluded from these results that the improvements in the resistivity and microstructure of Ag films result from the low-voltage sputtering. It can be concluded that the kinetic energy of the Ar gas particles decreased with decreasing the cathode voltage; as a result, the microstructure of Ag films should be improved.
    Keywords:Ag   Film   Low-emissivity coating   Low-voltage sputtering   Resistivity
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