| 物品贮运环境监测系统的抗冲击性能仿真分析 |
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| 引用本文： | 李杨,李新娥,张瑜,梁彦斌.物品贮运环境监测系统的抗冲击性能仿真分析[J].包装工程,2016,37(15):116-119. |
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| 作者姓名： | 李杨 李新娥 张瑜 梁彦斌 |
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| 作者单位： | 中北大学电子测试技术国家重点实验室,太原030051;中北大学仪器科学与动态测试教育部重点实验室,太原030051;中北大学电子测试技术国家重点实验室,太原030051;中北大学仪器科学与动态测试教育部重点实验室,太原030051;中北大学电子测试技术国家重点实验室,太原030051;中北大学仪器科学与动态测试教育部重点实验室,太原030051;中北大学电子测试技术国家重点实验室,太原030051;中北大学仪器科学与动态测试教育部重点实验室,太原030051 |
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| 摘 要： | 目的设计一种能实时监测物品贮运过程中的温度、湿度、加速度等3个参数并进行数据采集存储,同时能记录时间的具有高可靠性的贮运环境监测系统。方法通过有限元分析软件Ansys对壳体及电路板分别进行有限元抗冲击仿真。结果由壳体在冲击作用下的最大变形为0.03 mm及25.5 MPa的Von Miss等效应力证明壳体具有抗冲击可靠性,对电路板进行模态分析的结果证明,电路在环境冲击作用下能够可靠工作。结论设计的贮运环境监测系统具有良好的可靠性。
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| 关 键 词： | ARM 环境监测 采集存储 Ansys 模态分析 |
| 收稿时间： | 2016/1/18 0:00:00 |
| 修稿时间： | 2016/8/10 0:00:00 |
Simulation for Anti-impact Performance of Monitoring System in Storage and Transportation |
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| LI Yang,LI Xin-e,ZHANG Yu and LIANG Yan-bin.Simulation for Anti-impact Performance of Monitoring System in Storage and Transportation[J].Packaging Engineering,2016,37(15):116-119. |
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| Authors: | LI Yang LI Xin-e ZHANG Yu and LIANG Yan-bin |
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| Affiliation: | North University of China a.National Key Laboratory for Electronic Measurement Technology; b.Key Laboratory of In-strumentation Science and Dynamic Measurement, North University of China, Taiyuan 030051, China,North University of China a.National Key Laboratory for Electronic Measurement Technology; b.Key Laboratory of In-strumentation Science and Dynamic Measurement, North University of China, Taiyuan 030051, China,North University of China a.National Key Laboratory for Electronic Measurement Technology; b.Key Laboratory of In-strumentation Science and Dynamic Measurement, North University of China, Taiyuan 030051, China and North University of China a.National Key Laboratory for Electronic Measurement Technology; b.Key Laboratory of In-strumentation Science and Dynamic Measurement, North University of China, Taiyuan 030051, China |
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| Abstract: | This work aims to design an environmental monitoring system with high reliability that can monitor real-time temperature, humidity, acceleration in the storage and transportation process, collect data and record time. Finite element impact simulation was conducted on the circuit and shell by finite element analysis software Ansys. The maximum deformation of the shell was 0.03 mm and the Von Miss equivalent stress was 25.5 MPa under the impact effect. That proved the shell had shock resistance reliability. The results of PCB modal analysis proved that the circuit board could reliably work under the environmental impact. In conclusion, the designed environment monitoring system in storage and transportation has good reliability. |
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| Keywords: | ARM environmental monitoring collection and storage Ansys modal analysis |
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