| 应变率对无铅焊锡接点力学行为的影响 |
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| 引用本文： | 安彤,秦飞,王晓亮. 应变率对无铅焊锡接点力学行为的影响[J]. 焊接学报, 2013, 0(10): 59-62 |
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| 作者姓名： | 安彤 秦飞 王晓亮 |
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| 作者单位： | 北京工业大学机械工程与应用电子技术学院, 北京 100124,北京工业大学机械工程与应用电子技术学院, 北京 100124,北京工业大学机械工程与应用电子技术学院, 北京 100124 |
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| 基金项目： | 国家自然科学基金资助项目(10972012);北京工业大学博士研究生创新基金资助项目 |
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| 摘 要： | 对150℃条件下经过0,72,288,500 h等温时效的Cu/Sn3.0Ag0.5Cu/Cu焊锡接点试样进行了应变率为2×10-4,2×10-2和2 s-1的拉伸试验,研究了时效时间和应变率对焊锡接点抗拉强度和破坏模式的影响.结果表明,应变率对焊锡接点的抗拉强度有明显强化作用,抗拉强度随应变率的升高而增大.应变率从低到高的过程中,焊锡接点的破坏模式由焊料内部的韧性断裂逐渐转变为界面金属间化合物(intermetallic compound-IMC)层内的脆性断裂.
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| 关 键 词： | 焊锡接点 金属间化合物 应变率 抗拉强度 |
| 收稿时间： | 2013-04-17 |
Effect of strain rate on mechanical behavior of lead-free solder joints |
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| AN Tong,QIN Fei and WANG Xiaoliang. Effect of strain rate on mechanical behavior of lead-free solder joints[J]. Transactions of The China Welding Institution, 2013, 0(10): 59-62 |
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| Authors: | AN Tong QIN Fei WANG Xiaoliang |
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| Affiliation: | College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China,College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China and College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China |
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| Abstract: | Lap joints of 5A90 aluminium-lithium alloy were welded with refill friction spot welding process,in which the process parameters were changed for different purpose.The joint mechanical test of lap shear samples and cross tension samples, metallography analysis and joint microhardness test were carried out.The experimental results indicate that 1.5 mm thickness spot welded joint shear strength is more satisfying with tool rotation speed of 1800 r/min and welding time of 1.5 s.The cross tension test results shows thats the joint strength of cross tension increases with welding time,and insensitive to the change of weding tool rotational speed and press depth.The joint cross section metallograph show that the joint vertical interface is the weak joining area.The microhardness distribution indicates that the joint weak microzone locates in joint horizontal interface. |
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| Keywords: | solder joint intermetallic compound strain rate tensile strength |
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