| 球栅阵列封装中SnPb焊点的应力应变分析 |
| |
| 引用本文： | 陈云,徐晨.球栅阵列封装中SnPb焊点的应力应变分析[J].半导体技术,2006,31(11):823-827. |
| |
| 作者姓名： | 陈云 徐晨 |
| |
| 作者单位： | 东南大学,集成电路学院,南京,210096;南通大学,电子信息学院,江苏,南通,226007;南通大学,电子信息学院,江苏,南通,226007 |
| |
| 摘 要： | 基于SnPb焊料的统一粘塑性Anand本构模型,运用ANSYS有限元软件分析了球栅阵列封装中复合SnPb焊点在热循环过程中的应力、应变的分布,观察到SnPb焊料的蠕变行为和应力松弛现象,结果证明:外侧焊点经受的应力、应变范围比内侧焊点大;焊点的最高应力区域出现在Sn60Pb40焊料的最外缘处,最高应变区域出现在Pb90Sn10焊料与UBM层接触面的最上缘处.
|
| 关 键 词： | SnPb焊点 应力应变分布 ANSYS软件 球栅阵列 |
| 文章编号： | 1003-353X(2006)11-0823-05 |
| 收稿时间： | 2006-07-11 |
| 修稿时间： | 2006年7月11日 |
Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package |
| |
| CHEN Yun,XU Chen.Analysis on Stress and Strain Distribution of SnPb Solder Joint in BGA Package[J].Semiconductor Technology,2006,31(11):823-827. |
| |
| Authors: | CHEN Yun XU Chen |
| |
| Affiliation: | 1. School of IC, Southeast University, Nanjing 210096,China; 2. School of Electronic and Information Nantong University, Nantong 226007,China |
| |
| Abstract: | Based on the unified viscoplastic Anand model, using of ANSYS software, the distribution of the stress and strain in duplex SnPb solder joint during thermal cycling loading was analyzed. The creep and stress relaxation of the duplex SnPb solder joint were observed. The results show that the stress and strain value of the outside solder joint is greater than the inside solder joint; The most high stress area is at the extreme periphery of Sn60Pb40, the most high strain area is at the most upper limb of Pb90Sn10 and UBM surface. |
| |
| Keywords: | SnPb solder joint stress and strain distribution ANSYS BGA |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
