| Ar~+及沉积气压对离子溅射制备铜钨复合膜结构的影响 |
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| 引用本文： | 曾莹莹,艾永平. Ar~+及沉积气压对离子溅射制备铜钨复合膜结构的影响[J]. 兵器材料科学与工程, 2010, 33(4): 76-78. DOI: 10.3969/j.issn.1004-244X.2010.04.022 |
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| 作者姓名： | 曾莹莹 艾永平 |
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| 作者单位： | 井冈山大学,工学院,新型低碳环保建材研究所,江西,吉安,343009;井冈山大学,工学院,新型低碳环保建材研究所,江西,吉安,343009 |
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| 基金项目： | 江西省教育厅科技计划项目 |
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| 摘 要： | 研究双离子束溅射组装铜钨复合膜Ar+能量及束流对膜影响。用XRD分析溅射沉积后的薄膜结构。实验结果表明,随靶Ar+能量和束流增加,铜钨膜向晶态化转变。铜钨复合膜的沉积速率主要由钨靶Ar+束流决定,并且增加气压会使复合膜晶粒尺寸变小,固溶进钨的铜原子也会相应减少。
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| 关 键 词： | 铜钨薄膜 离子束溅射 Ar+能量 束流 晶粒度 |
Influence of Ar+ ion and deposition air pressure on microstructure of ion-beam sputtered copper-tungsten complex film |
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| ZENG Yingying,AI Yongping. Influence of Ar+ ion and deposition air pressure on microstructure of ion-beam sputtered copper-tungsten complex film[J]. Ordnance Material Science and Engineering, 2010, 33(4): 76-78. DOI: 10.3969/j.issn.1004-244X.2010.04.022 |
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| Authors: | ZENG Yingying AI Yongping |
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| Abstract: | The influence of Ar+ energy and ion beam on copper-tungsten film by double-ion-beam sputtering was studied.The microstructure of sputtered film was also studied by XRD.The results show that with the target Ar+ energy and ion beam flux increasing,copper-tungsten film is transformed into crystallization.The deposition rate of copper-tungsten complex film is mainly determined by tungsten target Ar+ ion beam flux and the increase of air pressure makes grain size become smaller,the solid solution of the copper a... |
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| Keywords: | Cu-W thin film ion beam sputtering Ar energy beam flux grain size |
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