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红外热成像信号处理技术的研究进展
引用本文:曹彦鹏,许宝杯,何泽威,官大衍,.红外热成像信号处理技术的研究进展[J].振动.测试与诊断,2018,38(2):219-227.
作者姓名:曹彦鹏  许宝杯  何泽威  官大衍  
作者单位:浙江大学流体动力与机电系统国家重点实验室;浙江大学浙江省先进制造技术重点研究实验室
基金项目:国家自然科学基金资助项目(51605428,51575486,U1664264)
摘    要:红外热成像技术通过二维图像的形式准确反映物体表面温度分布情况,广泛应用于医疗诊断、故障检测、能耗监控及智能驾驶等众多工业领域。针对制约红外热成像技术发展的3个主要瓶颈问题,分别阐述相关研究领域内最新的科研进展。首先,介绍红外信号固定模式噪声建模及除噪方法,解决信号采集系统中关键部件焦平面阵列传感器存在的严重噪声干扰;其次,介绍红外信号特征重建理论的研究,克服红外焦平面阵列探测器制作工艺复杂、成品率低及价格昂贵等制约了红外热成像技术广泛工业应用的问题;最后,探索多源信息融合技术,减少二维图像采集过程中降维映射导致的信息损失,提高基于多光谱信息进行目标检测系统的性能。红外热成像信号处理技术的最新科研进展,为新一代高成像精度、高分辨率、低制作成本的三维红外成像仪器的研发提供新理论与技术。

关 键 词:红外热成像  噪声建模  特征重建  信息融合

Research Advances in Infrared Thermography Signal Processing Technology
CAO Yanpeng,XU Baobei,HE Zewei,GUAN Dayan.Research Advances in Infrared Thermography Signal Processing Technology[J].Journal of Vibration,Measurement & Diagnosis,2018,38(2):219-227.
Authors:CAO Yanpeng  XU Baobei  HE Zewei  GUAN Dayan
Abstract:Infrared thermography accurately depicts the surface temperature distribution of objects in the form of two-dimensional images and has been widely used in many industrial applications such as medical diagnosis, fault detection, energy consumption monitoring and intelligent driving. In this article, the three major challenges that limit the development of infrared thermography is addressed. First of all, the modeling and denoising method is presented to eliminate fixed pattern noise in focal plane array sensor which is the key component in infrared imaging system. Secondly, IR signal reconstruction methodologies are introduced to overcome problems, such as complicated fabrication process, low yield and expensive price of IRFPA, to facilitate large-scale industrial applications. Finally, multi-modal information fusion technology is explored to restore the information lost during the process of 2D image acquisition and to improve the performance of target detection based on multi-spectral information. The latest advances in infrared imaging signal processing technology provide new theory and technology for the development of the next generation of high-quality, high-resolution, low-cost three dimensional infrared imaging system.
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