BGA封装循环弯曲试验与温度循环试验的关系

随着手持式产品在IC封装可靠性的需求增加,业界正在研究可减少时间与成本的可靠性评估方式。就我们所知,温度循环试验(thermal cycle testing)是验证焊点可靠性的重要测试之一,但其验证往往需要很长时间才知道结果。为了缩短验证时间,文章研究机械疲劳性试验取代温度循环试验的可能性。选择四点循环弯曲试验(cyclic bending test)为研究的重点,在JEDEC22-B113规范中的定义,四点循环弯曲试验条件包含频率跟位移来仿真实际的条件。

The Relationship between Cyclic Bending and Thermal Cycle Testing on BGA Package

With more reliability requirement increasing in the IC packaging for mobile product t,he industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task.In light of the long cycle time of thermal cycle testing,we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time.The 4-point cyclic bending test is considered a good candidate in this study.The 4-point cyclic bending condition including different bending frequency and ...