Hot-carrier degradation of submicrometer p-MOSFETs withthermal/LPCVD composite oxide |
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Authors: | Lee Y.-H. Yau L.D. Hansen E. Chau R. Sabi B. Hossaini S. Asakawa B. |
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Affiliation: | Intel Corp., Hillsboro, OR; |
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Abstract: | It is shown that while gate oxides containing thermal/LPCVD composite oxide have lower defect densities than gates using only thermal oxides, they are more susceptible to hot-carrier degradation. The hot-carrier-induced degradation of composite oxides is worse in p-channel MOSFETs than in n-channel MOSFETs. This sensitivity of p-channel MOSFETs is caused by higher electron trapping levels in LPCVD oxides. For 150-Å gate technology, the hot-carrier-degradation resistance of thermal/LPCVD composite gate oxides with a 70-Å or thicker thermal oxide layer approaches that of high-quality pure thermal oxide |
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