Effects of acrylic adhesives property and optimized bonding parameters on Sn58Bi solder joint morphology for flex-on-board assembly |
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| Affiliation: | 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2. Department of Materials Science and Engineering, KAIST, Daejeon, Republic South Korea;1. Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111, Iran;2. Delft University of Technology, EEMCS Faculty, Delft, The Netherlands;1. State Key Lab of Electronic Thin Films & Integrated Devices, University of Electronic Science & Technology of China, Chengdu, China;2. Institute of Biomedical Engineering, Chinese Academy of Medical Science and Peking Union Medical College, 300192 Tianjin, China;3. Design center, Avic Beijing Keeven Aviation Instrument CO., LTD, China Aviation Industry Corporation, Beijing, China;1. Federal University of Minas Gerais, Belo Horizonte, Brazil;2. Univ. Grenoble Alpes, CNRS, TIMA, Grenoble, France;1. Department of Electrophysics, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;2. Material and Design Engineering Division Engineering Center, SPIL, Taichung 400, Taiwan, ROC;1. Institute of Biomedical Engineering, Chinese Academy of Medical Science and Peking Union Medical College, 300192 Tianjin, China;2. State Key Lab of Electronic Thin Films & Integrated Devices & Biomedical Engineering Department, University of Electronic Science & Technology of China, Chengdu, China;3. Design center, Avic Beijing Keeven Aviation Instrument CO., LTD, China Aviation Industry Corporation, Beijing, China |
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| Abstract: | Acrylic resin with a fast curable property has been used in low temperature ACFs applications. However, its poor thermo-mechanical property was a concern for solder ACFs applications. In this study, a novel thermomechanical analysis (TMA) method was introduced to measure its polymer rebound amounts due to pressures removal after a thermo-compression (TC) bonding process. Polymer resin was laminated between two silicon chips (7 1 7 mm2), and then a compressive mode TMA measurement was done on the prepared samples. Constant compressive pressures were applied until the temperature was gradually increased to target temperature, and the forces were removed at the target temperatures. The polymer rebound was measured by monitoring the z-axis dimension change after the compressive forces was removed. In addition, the effects of bonding temperatures (from 150 to 250 °C) and the bonding pressures (1, 2 and 3 MPa) on the SnBi58 (139 °C melting point) solder joints morphologies and joint resistances were evaluated to investigate acrylic resin property and find out the optimized bonding conditions for low Tg acrylic-based solder ACFs applications. |
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