Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints |
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| Affiliation: | 1. Department of Electrophysics, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;2. Department of Mechanical Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;3. Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwan, ROC;4. Research Group of Biomedical Image Processing, Shing-Tung Yau Center, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;5. Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;6. Material and Design Engineering Division Engineering Center, Siliconware Precision Industries Co., Ltd., Taichung 400, Taiwan, ROC;7. Department of Mechatronic Engineering, National Taiwan Normal University, Taipei City 106, Taiwan, ROC;1. State Key Lab of Electronic Thin Films & Integrated Devices, University of Electronic Science & Technology of China, Chengdu, China;2. Institute of Biomedical Engineering, Chinese Academy of Medical Science and Peking Union Medical College, 300192 Tianjin, China;3. Design center, Avic Beijing Keeven Aviation Instrument CO., LTD, China Aviation Industry Corporation, Beijing, China;1. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;2. Department of Electrical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;1. Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP, Brazil;2. Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP, Brazil |
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| Abstract: | The comparison study of Sn-10Bi and Sn-3.0Ag-0.5Cu solder alloys and joints was conducted. The results showed that the liquidus of Sn-10Bi solder alloy was lower than that of Sn-Ag-Cu slightly. The interfacial IMCs layer growth of Sn-10Bi/Cu was slower than that of Sn-Ag-Cu/Cu during liquid/solid reaction. The higher strength and lower creep strain rate of Sn-10Bi comparing with that of Sn-Ag-Cu were contributed by the solid solution strengthening effect of Bi atom in β-Sn phase. The ultimate bending load of Sn-10Bi joint was higher than that of Sn-Ag-Cu joint as the high strength of Sn-10Bi solder alloy. Moreover, the thinner and more flat IMCs layer also ensured the stable maximum bending displacement of Sn-10Bi joint at a loading speed of 1 mm/s compared with that of Sn-Ag-Cu joint. |
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