Color shift acceleration on mid-power LED packages |
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| Affiliation: | 1. Beijing Research Center, Delft University of Technology, Beijing, China;2. Delft University of Technology, EEMCS Faculty, Delft, The Netherlands;3. Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, China;4. State Key Laboratory of Solid State Lighting, Changzhou, China;5. Department of Mechanical Engineering, Lamar University, Beaumont, TX 77710, USA;1. Mechanical Engineering Department, University of Maryland College Park, MD 20742, USA;2. Mechanical and Aerospace Engineering, Seoul National University, Republic of Korea;3. Package Development Team, Semiconductor R&D Center, Samsung Electronics, Republic of Korea;1. Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP, Brazil;2. Federal Institute of Education, Science and Technology of Pará, IFPA, 66093-020 Belém, PA, Brazil;1. Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan;2. Department of Engineering Physics, Electronics and Mechanics, Nagoya Institute of Technology, Nagoya 466-8555, Japan;1. Department of Electrophysics, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;2. Department of Mechanical Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;3. Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwan, ROC;4. Research Group of Biomedical Image Processing, Shing-Tung Yau Center, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;5. Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;6. Material and Design Engineering Division Engineering Center, Siliconware Precision Industries Co., Ltd., Taichung 400, Taiwan, ROC;7. Department of Mechatronic Engineering, National Taiwan Normal University, Taipei City 106, Taiwan, ROC;1. Department of Electrical Engineering, National Taiwan Normal University, Taiwan;2. Institute of Electronics, National Chiao Tung University, Taiwan |
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| Abstract: | Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages. Temperature stress, humidity stress and current stress were experimentally designed and performed to accelerate the color shift of mid-power LED packages and color shift mechanisms have been discussed based on the color shift results obtained from measurements. Conclusions could be drawn:- -Linear function fitting demonstrates a good linear relationship between color shift (Δu′ Δv′) and aging time almost for all the aging conditions. We can extrapolate the color shift Δu′ and Δv′ based on the fitted regression equations and then make the prediction for the total color shift Δu′v′.
- -Current stress can induce a different failure mode. Peak intensity reduction analysis reveals that the current stress accelerates the degradation of LED die.
- -Humidity test induced a substantial color shift both in u′ and v′. The u′ has an increased degradation rate after aging of 3000 h at 85%RH & 85 °C, there should be different degradation mechanisms during the whole humidity test. The molecular structure decomposition of silicone plates and then follows the silicone carbonization due to the long-term (3000 h) accumulated high localized temperature aging.
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