Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages |
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| Affiliation: | 1. School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia;2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia;3. Jabil Circuits, 56, Hilir Sungai Kluang 1, Bayan Lepas, 11900, Penang, Malaysia;4. School of Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia;1. Province-Ministry Joint Key Laboratory of Electromagnetic Field and Electrical Apparatus Reliability, Hebei University of Technology, Tianjin 300130, China;2. Institute of Project Management, Department of Leisure Industry Management, National Chin-Yi University of Technology, Taichung 41170, Taiwan;3. Department of Logistics Management, National Defense University, Taipei, 112, Taiwan;1. Department of Electrical Engineering, Centro Universitário FEI, Av. Humberto de Alencar Castelo Branco, 3972, CEP 09850-901 São Bernardo do Campo, Brazil;2. Département des Composants Silicium – SCME/LCTE, CEA-LETI Minatec, 17 Rue des Martyrs, 38054 Grenoble, France;1. Department of Electrophysics, National Chiao Tung University, Hsinchu 300, Taiwan, ROC;2. Material and Design Engineering Division Engineering Center, SPIL, Taichung 400, Taiwan, ROC |
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| Abstract: | This paper presents a 3D numerical simulation of nano-reinforced lead (Pb)-free solder at the ultra-fine joint component for 01005 capacitor with dimension of 0.2 × 0.2 × 0.4 mm3. The nano-reinforced particles introduced in the Sn-3.0Ag-0.5Cu (SAC305) solder is titanium oxide (TiO2) nanoparticles with approximate diameter of ≈ 20 nm at different weight percentages of 0.01, 0.05 and 0.15 wt% respectively. The 3D model developed is based on the reflow thermal profile of nano-reinforced Pb-free solder in the wetting zone temperature of 217 °C–239 °C. A two way interactions utilizing both volume of fluid method (VOF) and discrete phase method (DPM) are introduced in the current study. The study effectively shows the distribution of the nanoparticles as it is being doped in the molten solder after undergoing soldering process. Based on the findings, it was shown that good agreement can be seen between experimental data obtained using High Resolution Transmission Electron Microscope (HRTEM) system as compared to multiphase DPM based simulation. At weight percentage of SAC305 + 0.05% TiO2 nanoparticles, the nanoparticles are well distributed. The fillet height of nano-reinforced solder also meets the minimum requirement for 01005 capacitor. Additionally, as the weight percentage of the doped nanoparticles increases, the time required for the formation of wetted solder also increases. In terms of the velocity and pressure distribution of the nano-reinforced lead (Pb)-free solder, higher weight percentage of doped nanoparticles have higher velocity distribution and lower pressure distributions. |
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