| 基于响应面法的铜电解精炼槽电压预测模型 |
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| 引用本文： | 任兵芝,夏文堂,王宏丹,向 威,王 磊.基于响应面法的铜电解精炼槽电压预测模型[J].有色金属工程,2019,9(2). |
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| 作者姓名： | 任兵芝 夏文堂 王宏丹 向 威 王 磊 |
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| 作者单位： | 重庆科技学院冶金与材料工程学院 |
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| 基金项目： | 国家自然科学(51674057)；重庆市教委科学技术研究项目(KJ1601326,KJ1713343)；重庆市基础科学与前沿技术研究专项(cstc2016jcyjA0142,cstc2017jcyjAX0236)；重庆科技学院校内科研(CK2016B19) |
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| 摘 要： | 在铜电解精炼过程中,最主要的能耗是直流电耗,而槽电压对直流电耗的影响最大。针对铜电解精炼过程,首先采用Plackett-Burman实验设计法筛选出对铜电解精炼槽电压具有显著影响的4个因素,其显著性次序为:电解液温度电流密度阴阳极间隙硫酸浓度;然后根据中心复合实验设计(Central composite design,CCD)原理设计的4因素5水平实验及响应面法(Response surface methodology,RSM)对影响铜电解精炼槽电压的显著因素做进一步优化,建立了多元二次回归方程拟合模型。在电流密度为280A/m2的前提下,得到槽电压最低的工艺条件为:电解液温度60℃、硫酸浓度210g/L、阴阳极间隙20mm。实验表明,基于响应面法建立的预测模型是准确可靠的,对降低铜电解精炼能耗具有良好的指导作用。
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| 关 键 词： | 铜电解精炼 能耗 响应面法 槽电压 Plackett-Burman设计 |
| 收稿时间： | 2018/3/4 0:00:00 |
| 修稿时间： | 2018/3/7 0:00:00 |
Prediction model for cell voltage of copper electrorefining using response surface methodology |
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| REN Bingzhi,XIA Wentang,WANG Hongdan,XIANG Wei and WANG Lei.Prediction model for cell voltage of copper electrorefining using response surface methodology[J].Nonferrous Metals Engineering,2019,9(2). |
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| Authors: | REN Bingzhi XIA Wentang WANG Hongdan XIANG Wei and WANG Lei |
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| Affiliation: | Department of Metallurgical Engineering,School of Metallurgical and Materials Engineering,Chongqing University of Science and Technology,Department of Metallurgical Engineering,School of Metallurgical and Materials Engineering,Chongqing University of Science and Technology,Department of Metallurgical Engineering,School of Metallurgical and Materials Engineering,Chongqing University of Science and Technology,Department of Metallurgical Engineering,School of Metallurgical and Materials Engineering,Chongqing University of Science and Technology,Department of Metallurgical Engineering,School of Metallurgical and Materials Engineering,Chongqing University of Science and Technology |
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| Abstract: | |
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| Keywords: | copper electrorefining power consumption response surface methodology cell voltage Plackett-Burman design |
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