| 急冷型Sn-Ag-Cu系钎料钎焊接头力学性能与显微组织 |
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| 引用本文： | 张鑫,张柯柯,涂益民,熊毅. 急冷型Sn-Ag-Cu系钎料钎焊接头力学性能与显微组织[J]. 焊接技术, 2010, 39(1) |
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| 作者姓名： | 张鑫 张柯柯 涂益民 熊毅 |
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| 作者单位： | 1. 河南科技大学,材料科学与工程学院,河南,洛阳,471003;河南省有色金属材料科学与加工技术重点实验室,河南,洛阳,471003
2. 河南科技大学,材料科学与工程学院,河南,洛阳,471003 |
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| 基金项目： | 国家自然科学基金资助项目(50801021);;河南科技大学青年科学研究基金资助项目(2007QN057);;河南科技大学人才科学研究基金资助项目(05-007) |
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| 摘 要： | 采用单辊法制备了急冷型Sn-Ag-Cu系钎料合金,在对其进行熔化温度特性和XRD分析检测后,进行了钎焊工艺试验,并对所得接头的抗剪强度和显微组织进行了测试分析,研究了钎焊温度对接头组织性能的影响。结果表明:在不同的钎焊温度条件下,接头界面处金属间化合物的形成及分布是不同的,并由此导致了接头抗剪强度的变化。
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| 关 键 词： | 急冷 Sn-Ag-Cu系钎料 钎焊温度 力学性能 显微组织 |
Study on the mechanical properties and microstructure of soldering joints with down quenching Sn-Ag-Cu solder alloy foil |
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| ZHANG Xin,ZHANG Ke-ke,TU Yi-min,XIONG Yi. Study on the mechanical properties and microstructure of soldering joints with down quenching Sn-Ag-Cu solder alloy foil[J]. Welding Technology, 2010, 39(1) |
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| Authors: | ZHANG Xin ZHANG Ke-ke TU Yi-min XIONG Yi |
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| Affiliation: | 1.College of Materials Science and Engineering;Henan University of Science and Technology;Luoyang 471003;Henan pro.;China;2.Henan Key Laboratory of Advanced Non-ferrous Metals;China |
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| Abstract: | The down quenching Sn-Ag-Cu solder alloy was prepared by using single-roller method. After the melting temperature and XRD test was done, the soldering procedure was tested. By testing and analyzing the shearing strength and microstructure of the joints, the effect of soldering temperature on the microstructure and property of the joints was studied. The results showed that the IMC on the joint boundary showed difference in its formation and distribution under different soldering temperatures, and this also... |
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| Keywords: | down quenching Sn-Ag-Cu soldering temperature shearing strength IMC |
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