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Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder |
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| Authors: | T YAMAMOTO M IWATA M SAKANE Y TSUKADA H NISHIMURA |
| Affiliation: | Department of Mechanical Engineering, Oita University, 700, Dannoharu, Oita-shi, Oita 870-1192, Japan;, Department of Mechanical Engineering, Ritsumeikan University, 1-1-1, Nojihigashi, Kusatsu-shi, Shiga 525-8577, Japan;, Kyocera SLC Technology Corporation. Ltd., 656, Ichimiyake, Yasu-shi, Shiga, 520-2362, Japan;, IBM Japan Ltd. Yasu, 800, Ichimiyake, Yasu-cho, Yasu-gun, Shiga, 520-2392, Japan |
| Abstract: | This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb. |
| Keywords: | creep-fatigue effect of strain waveform life prediction lead-free solder Sn–8Zn–3Bi |