| 集成电路组装后的清洗与免清洗技术 |
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| 引用本文： | 王劲松. 集成电路组装后的清洗与免清洗技术[J]. 电子元件与材料, 2001, 20(4): 35-35 |
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| 作者姓名： | 王劲松 |
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| 作者单位： | 华经微电子有限公司, |
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| 摘 要： | 从超声波清洗用清洗溶剂，特别是替代消耗臭氧层物质的氯化氟代碳（CFC）清洗溶剂等方面介绍了集成电路的清洗技术；还介绍了集成电路的免清洗工艺技术, 使用免清洗工艺技术对各道关键工序的控制及采用免清洗技术的主要优势。
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| 关 键 词： | 清洗 免清洗 消耗臭氧层物质 |
| 文章编号： | 1001-2028(2001)04-0035-01 |
Cleaning Technologies and Non-cleaning Technology for IC Packages |
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| WANG Jin-song. Cleaning Technologies and Non-cleaning Technology for IC Packages[J]. Electronic Components & Materials, 2001, 20(4): 35-35 |
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| Authors: | WANG Jin-song |
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| Abstract: | Cleaning agents used for ultrasonic cleaning technology, especially the substitutes for CFC are introduced. Non-cleaning technology is also discussed, including its important procedures, applications and advantages |
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| Keywords: | cleaning technology non-cleaning technology ozone depleting |
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