| 环氧树脂/聚酰胺/DDM体系的固化行为及力学性能 |
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| 引用本文： | 董新,蔡智奇,皮丕辉,杨卓如.环氧树脂/聚酰胺/DDM体系的固化行为及力学性能[J].热固性树脂,2011(1):21-24,30. |
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| 作者姓名： | 董新 蔡智奇 皮丕辉 杨卓如 |
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| 作者单位： | 华南理工大学化学与化工学院; |
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| 基金项目： | 广东省科技厅省部产学研项目资助(2009B090600056) |
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| 摘 要： | 通过非等温DSC法及拉伸性能测试研究了4,4'-二氨基二苯基甲烷(DDM)用量对环氧树脂/聚酰胺651体系的固化反应的影响,计算了固化反应的表观活化能和反应级数,确定了其胶粘剂体系的固化工艺参数。结果表明,胶粘剂中DDM的质量分数达到14%(以环氧树脂质量为基准)时,固化反应放热量达到最大值。固化体系的活化能为53.654 kJ/mol,反应级数为0.895。最佳起始固化温度为40℃,峰值温度为85℃,终止温度为120℃,体系的拉伸强度提高了约50%。
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| 关 键 词： | 环氧树脂 4 4'-二氨基二苯基甲烷 固化工艺参数 非等温DSC 拉伸强度 |
Curing behavior and mechanical properties of DGEBA/PA/DDM systems |
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| DONG Xin,CAI Zhi-qi,PI Pi-hui,YANG Zhuo-ru.Curing behavior and mechanical properties of DGEBA/PA/DDM systems[J].Thermosetting Resin,2011(1):21-24,30. |
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| Authors: | DONG Xin CAI Zhi-qi PI Pi-hui YANG Zhuo-ru |
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| Affiliation: | DONG Xin,CAI Zhi-qi,PI Pi-hui,YANG Zhuo-ru (School of Chemical and Chemical Engineering,South China University of Technology,Guangzhou 510641,China) |
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| Abstract: | The effect of DDM amounts on the curing process of epoxy resin/polyamide 651 system was investigated by the non-isothermal DSC and the tensile strength test.The apparent activation energy and the order of reaction were calculated and the curing process parameters of adhesives were determined.The results showed that the heat release of the curing reaction of the adhesives with 14% DDM(based on the weight of epoxy resin)reached the maximum.The activation energy was 53.654 kJ/mol and the reaction order was 0.8... |
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| Keywords: | epoxy resin DDM curing process parameter non-isothermal DSC tensile strength |
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