| Sn-3Ag-3Bi焊点剪切强度的研究 |
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| 引用本文： | 谷博,王珺,唐兴勇,俞宏坤,肖斐.Sn-3Ag-3Bi焊点剪切强度的研究[J].电子元件与材料,2006,25(10):34-36. |
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| 作者姓名： | 谷博 王珺 唐兴勇 俞宏坤 肖斐 |
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| 作者单位： | 复旦大学材料系,上海,200433;复旦大学材料系,上海,200433;复旦大学材料系,上海,200433;复旦大学材料系,上海,200433;复旦大学材料系,上海,200433 |
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| 基金项目： | APEC科技产业合作基金 |
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| 摘 要： | 提出一种可有效降低测试误差的剪切强度测试方法。用该方法对Sn-Ag-Bi无铅焊料分别在Cu基板和Ni-P基板上的焊点,经不同的热时效后的剪切强度,进行了测量并对断裂面的微观结构进行了研究。结果显示,焊点的剪切强度及断裂位置与焊接界面金属间化合物(IMC)的组成和厚度有关。
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| 关 键 词： | 金属材料 无铅焊料 Sn-Ag-Bi 剪切强度 金属间化合物 |
| 文章编号： | 1001-2028（2006）10-0034-03 |
| 收稿时间： | 2006-04-28 |
| 修稿时间： | 2006-04-28 |
Study on Shear Strength for Sn-3Ag-3Bi Solder Joint |
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| GU Bo,WANG Jun,TANG Xing-yong,YU Hong-kun,XIAO Fei.Study on Shear Strength for Sn-3Ag-3Bi Solder Joint[J].Electronic Components & Materials,2006,25(10):34-36. |
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| Authors: | GU Bo WANG Jun TANG Xing-yong YU Hong-kun XIAO Fei |
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| Affiliation: | Department of Material Science, Fudan University, Shanghai 200433, China |
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| Abstract: | A new shear test method was proposed, by which the testing errors were effectively suppressed. With the new test method, Sn-3Ag-3Bi lead-free solder joints on Cu and Ni-P board for aging up to 1 000 hours were tested respectively. Moreover, the microstructures of solder joints facture surface were studied. The data showed that shear strength and fracture location of joints are related to the composition and thickness of the intermetallic compound (IMC) at the interface between solder and board materials. |
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| Keywords: | Sn-Ag-Bi |
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