| 下一代线路板的发展展望 |
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| 引用本文： | 祝大同. 下一代线路板的发展展望[J]. 印制电路信息, 2010, 0(5): 21-25,64 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 中国电子材料行业协会,北京,100028 |
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| 摘 要： | 日本“下一代线路板研究会”对未来十年安装技术及线路板技术的发展作了研究、预测。特别是对Ic封装用封装基板、携带型电子产品用基板、汽车电子用基板、高频电路基板的未来发展作了预测、展望。文章对此研究会此课题的讨论、研究的成果做以综述。
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| 关 键 词： | 印制线路板 半导体 发展 |
Overview of Next Generation Printed Wiring Boards |
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| ZHU Da-tong. Overview of Next Generation Printed Wiring Boards[J]. Printed Circuit Information, 2010, 0(5): 21-25,64 |
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| Authors: | ZHU Da-tong |
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| Affiliation: | ZHU Da-tong |
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| Abstract: | Japanese Committee of Next Generation Printed Wiring Boards has forecasted the development of assembly and PCB technology in future ten years. IC package substrate and substrate used in portability electronic product, automobile electron, high frequency application were introduced especially. In the paper, the conclusion of Japanese Committee of Next Generation Printed Wiring Boards was reviewed. |
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| Keywords: | Printed Wiring Boards semiconductor development |
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