玻璃通孔的高频传输性能

随着玻璃通孔(TGV)制作工艺的成熟,微波毫米波系统采用玻璃基板进行集成,其高频传输特性成为研究的重点。对玻璃通孔的互连设计、制作和传输性能进行研究。在玻璃基板上分别设计直通传输线和带两个TGV、等长传输线的TGV传输结构;通过激光改性、腐蚀扩孔和电镀填充的TGV工艺制作技术以及薄膜电路布线技术,在玻璃基板上制作直通传输线和TGV传输结构;采用矢量网络分析仪法分别测试直通传输线和TGV传输结构的插入损耗,计算得到单个TGV的插入损耗,结果显示在33~40 GHz频段内单个TGV插入损耗S₂₁≤0.2 dB,可以满足微波毫米波系统集成应用中对玻璃基板通孔的低传输损耗要求。

High Frequency Transmission Performance of Through Glass Via

With the maturity of through glass via(TGV)processing technique,microwave and millimeter wave systems are integrated with glass substrates,and high frequency transmission performance of the TGVs becomes the research focus.The interconnection design,fabrication and transmission performance of the TGVs were studied.A straight-through transmission line and a TGV transmission structure with two-TGV and isometric transmission lines were designed on the glass substrate,respectively.By using the TGV technology of laser modification,etching and reaming,electroplating filling processing,as well as thin-film circuit layout technology,the straight-through transmission line and the TGV transmission structure were fabricated on the glass substrate.By using vector network analyzer method,the insertion losses of the straightthrough transmission line and the TGV transmission structure were measured,respectively,and then the insertion loss of a single TGV was calculated.The result shows that the insertion loss S₂₁ isn’t more than0.2 dB within the frequency band of 33-40 GHz,meeting the requirement for low transmission loss of the glass substrate through hole in the integration of microwave and millimeter wave systems.