咪唑促进双氰胺固化环氧树脂体系固化动力学

采用差示扫描量热(DSC)法研究了2-乙基-4-甲基咪唑(2E4MI)的含量对双氰胺(DICY)固化环氧树脂体系固化动力学的影响。非等温DSC测试结果表明,2E4MI能大幅度降低DICY固化环氧树脂所需要的温度和活化能,从而加快反应的进行。当2E4MI用量为0.2份时,活化能最低为84.2 kJ/mol且整体活化能随固化度的变化较小、固化更均匀。在2E4MI最佳用量(0.2份)下对固化体系进行等温DSC以及潜伏性测试,结果表明,该体系在160℃下20 min内可完成固化,室温储存15 d的固化度仅为0.146,说明其适合用作快速固化环氧树脂储存体系。

Curing Kinetics of Dicyandiamide Cured Epoxy System Promoted by Imidazole

The effects of 2-ethyl-4-methylimidazole(2E4MI)contents on curing kinetics of dicyandiamide(DICY)cured epoxy resin system were studied by differential scanning calorimetry(DSC)method.The testing results of non-isothermal DSC demonstrate that 2E4MI can greatly reduce the temperature and activation energy required for DICY curing epoxy resin,thus accelerating the reaction.When the content of 2E4MI is 0.2 phr,the activation energy is the lowest(84.2 kJ/mol),and the overall activation energy changes little with the curing degree changing,resulting in more uniform curing.Finally,0.2 phr was selected as the optimal content of 2E4MI,and the curing system was used for isothermal DSC and latent study.The results show that the system can be cured within 20 minutes at 160℃,and the curing degree is only 0.146 within 15 days storage at room temperature,indicating that it is suitable for fast curing epoxy resin storage system.