| 高功率LED封装支架基体树脂研究进展 |
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| 引用本文： | 张磊,金子毅,李亦灵,张丽. 高功率LED封装支架基体树脂研究进展[J]. 工程塑料应用, 2021, 49(1): 141-145,151 |
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| 作者姓名： | 张磊 金子毅 李亦灵 张丽 |
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| 作者单位： | 西安交通大学电力设备电气绝缘国家重点实验室,西安 710049;浙江理工大学材料科学与工程学院,杭州 310018;浙江理工大学材料科学与工程学院,杭州 310018;辽宁省药品检验检测认证中心,辽宁省药品检验检测院,沈阳 110036 |
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| 基金项目： | 电力设备电气绝缘国家重点实验室项目(EIPE19204)。 |
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| 摘 要： | 介绍了目前聚合物基LED封装支架基体树脂的研究进展,回顾了通用聚苯二甲酸型聚酰胺树脂(PPA)型基体树脂在表面贴片、大电流驱动、器件尺寸紧凑化以及极端环境应用等发展要求下的困境,分析了聚对苯二甲酸环己烷二甲酯、芳香族热致液晶聚酯树脂、环氧树脂、有机硅改性模塑料、不饱和聚酯树脂等新型封装支架基体树脂的特点,重点比较了树脂的初始反射率、老化反射率、耐热温度、玻璃化转变温度和吸水率等材料性能,强调了不同树脂在实际应用中的比较优势及局限性。分析表明,新型基体树脂在光学性能方面相比于PPA型树脂优势显著,但材料成本亦显著提高。指出随着生产企业由光视效能向成本效率的思路转变,满足极端应用环境需求,同时兼顾高性价比可能是未来LED支架基体树脂的发展方向。
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| 关 键 词： | 封装材料 LED 基体树脂 光学性能 耐热性能 |
Advance in Martrix Resin for High Power LED Bracket Packaging |
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| Zhang Lei,Jin Ziyi,Li Yiling,Zhang Li. Advance in Martrix Resin for High Power LED Bracket Packaging[J]. Engineering Plastics Application, 2021, 49(1): 141-145,151 |
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| Authors: | Zhang Lei Jin Ziyi Li Yiling Zhang Li |
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| Affiliation: | (State Key Laboratory of Electrical Insulation and Power Equipment,Xi’an Jiaotong University,Xi’an 710049,China;School of Materials Science and Engineering,Zhejiang Sci-Tech University,Hangzhou 310018,China;Liaoning Drug Testing and Certification Center,Liaoning Institute for Drug Control,Shenyang 110036,China) |
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| Abstract: | Recent progress of matrix resins for LED packaging was introduced.The challenges in surface-mounting,largecurrent drive,compact structure and severe environmental operation of PPA were considered,the features of PCT,LCP,EMC,SMC and UP were analyzed.Initial and aging reflectivity,thermal resistance and glass transition temperature,as well as water absorption were compared.Comparative advantages and limitations of each resin were emphasized.The results indicate that new resins exhibit better optical properties than PPA,with higher material costs.It is suggested that accompanied with the conversion from luminous efficiency to cost efficiency industry,resins enable to satisfy requirements of severe conditions while simultaneously with high cost performance would be the direction in future. |
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| Keywords: | packaging material LED matrix resin optical property thermal resistance |
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