Nano-milling on monocrystalline copper: A molecular dynamics simulation

Nano-milling is a promising technique for making miniaturized ultraprecision components. However, its underlying material removal mechanism is unclear and the accurate prediction of its performance is lacking. This study performs a systematic molecular dynamics analysis to reveal the material removal in the nano-milling of monocrystalline copper. It was found that the grooves by nano-milling, regardless of the machining parameters used, have two common features: (i) the groove top edge distortion is due to the effects of surface energy and high strain rate and (ii) the groove profile at the outlet side of the tool rotation aligns more closely with the designed geometry as a result of the atom flow variation and residual stress distribution. A dimensional analysis showed that the cutting speed factor and groove dimension factor significantly influence the specific energy and material removal rate in nano-milling. The groove quality can be improved by increasing the groove dimension factor or by decreasing the cutting speed factor. Finally, a machinability chart was developed for quality nano-milling processes.