| 粘接用银膏粘接性能的研究 |
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| 引用本文： | 吴红,刘芳.粘接用银膏粘接性能的研究[J].粘接,2010,31(5):54-55. |
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| 作者姓名： | 吴红 刘芳 |
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| 作者单位： | 国家钽铌特种金属材料工程技术研究中心,宁夏,石嘴山,753000 |
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| 摘 要： | 对粘接用银膏（以下简称银膏）的粘接性能进行了分析和研究，主要对偶联剂和增韧剂对粘接强度的影响进行了讨论，通过试验确定了最佳偶联剂和增韧剂及用量，优化了配方，提高了粘接性能。
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| 关 键 词： | 粘接银膏 偶联剂 增韧剂 粘接力 体积电阻率 |
Research on bonding performance of silver paste for bonding |
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| WU Hong,LIU Fang.Research on bonding performance of silver paste for bonding[J].Adhesion in China,2010,31(5):54-55. |
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| Authors: | WU Hong LIU Fang |
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| Affiliation: | (National Research Center of Tantalum Niobium Special Metal Materials,Shizuishan, Ningxia 753000,China) |
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| Abstract: | The article researches and analyzes the bonding performance of silver paste for bonding. And mainly discusses the effects of coupling agent and toughening agent on the bonding strengh. The optimal kind and content of coupling agent and toughening agent were determined, the formulation was optimized and the bonding performance was increased. |
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| Keywords: | silver paste coupling agent toughening agent bonding strength bulk resistivity |
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