A new flip-chip bonding technique using micromachined conductivepolymer bumps |
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Authors: | Oh KW Ahn CH |
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Affiliation: | Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH; |
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Abstract: | Using micromachining techniques with thick photoresists, a new conductive polymer flip-chip bonding technique that achieves both a low processing temperature and a high bumping alignment resolution has been developed in this work. By the use of UV-based photolithography with thick photoresists, molds for the flip-chip bumps have been patterned, filled with conductive polymers, and then removed, leaving molded conductive polymer bumps. After flip-chip bonding with the bumps, the contact resistances measured for 25 μm-high bumps with 300 μm×300 μm area and 400 μm×400 μm area were 35 mΩ and 12 mΩ respectively. The conductive polymer flip-chip bonding technique developed in this work shows a very low contact resistance, simple processing steps, a high bumping alignment resolution (<±5 μm), and a lower bonding temperature (~170°C). This new bonding technique has high potential to replace conventional flip-chip bonding technique for sensor and actuator systems, bio/chemical μ-TAS, optical MEMS, OE-MCM's, and electronic system applications |
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