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影响聚晶金刚石复合片性能的因素及改进方法
引用本文:高万夫,焦淑静,高伟.影响聚晶金刚石复合片性能的因素及改进方法[J].金刚石与磨料磨具工程,2003(4):33-36,40.
作者姓名:高万夫  焦淑静  高伟
作者单位:石油大学材料工程系,北京,102249
摘    要:聚晶金刚石复合片作为PDC钻头的切削元件,其质量的好坏直接影响着整个钻头的钻进速率及使用寿命。影响复合片质量和性能的主要因素是金刚石与粘接剂的配比、粘接剂的种类、金刚石的粒度、金刚石/硬质合金界面结构以及烧结工艺等。本文探讨了不同种类粘接剂的优、缺点;介绍了如何通过改变金刚石颗粒的粒度分布提高复合片的耐磨性和抗冲击性能;在金刚石,硬质合金界面处添加碳化物形成元素薄片以及采用金属镀层(如W等)实现界面的冶金结合,从而提高界面的结合强度;采用锯齿形界面并伴随成分梯度过渡、以及采用正弦曲线形界面结构可明显改善复合片的性能。这些方法可为工业上生产优质复合片提供参考。

关 键 词:聚晶金刚石复合片  粘接剂  成分  结构  粒度  性能
文章编号:1006-852X(2003)04-0033-04

FACTORS AND MODIFICATION METHODS INFLUENCING PERFORMANCES OF POLYCRYSTALLINE DIAMOND COMPACT
Gao Wanfu,Jiao Shujing,Gao wei.FACTORS AND MODIFICATION METHODS INFLUENCING PERFORMANCES OF POLYCRYSTALLINE DIAMOND COMPACT[J].Diamond & Abrasives Engineering,2003(4):33-36,40.
Authors:Gao Wanfu  Jiao Shujing  Gao wei
Abstract:The quality of polycrystalline diamond compacts (PDC), used as cutting parts for PDC bits, directly influences bit drilling rate and its lifespan. The main factors affecting the quality and performances of PDC are the compositional ratio of diamond and the binder, the selection of binders, diamond grain size, interfacial structure of diamond/hard alloy and sintering techniques. This paper discussed advantages and disadvantages of varieties of binders and reviewed the ways to improve wear and impact resistance for PDC by altering diamond grain size and by the addition of the film containing carbide forming elements to the interface of diamond/hard alloy in order to form the metallurgical bond in the interface through the application of metallic plating, e.g., tungsten, which result in the improvement of bond strength in the interface. In addition, the possibility of utilizing the saw tooth interface along with compositional gradient variation and the sine shaped interface, which helps to improve PDC performances, was also generalized. This review can hopefully provide references for production of good quality PDC for bit making industries.
Keywords:polycrystalline diamond compact  property  composition  structure  size
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