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非超净条件下玻璃微流控芯片加工工艺
引用本文:谢海波,傅新,杨华勇. 非超净条件下玻璃微流控芯片加工工艺[J]. 浙江大学学报(工学版), 2007, 41(4): 560-563
作者姓名:谢海波  傅新  杨华勇
作者单位:杨华勇,男,教授. E-mail:yhy@zju.edu.cn
基金项目:国家自然科学基金重点资助项目(50335010).
摘    要:为了解决玻璃微流控芯片加工工艺对专业实验室的依赖问题,提出了一种非超净环境下玻璃材料微加工工艺.该工艺包含湿法刻蚀和高温键合两项关键技术,针对刻蚀工艺中高刻蚀速率与高刻蚀表面质量兼具的工艺目标,研究了多种刻蚀剂成分及配比等条件对刻蚀效果的影响,并描述了具体工艺流程与工艺参数.在高温键合工艺试验中针对表面亲和处理、抽真空预键合以及键合温度时序控制等方面进行研究,重点讨论了非超净环境下高效预键合方法.结果表明,所研究的湿法刻蚀和高温键合两项工艺具有简单、高效、设备依赖性低等特点,突破了超净环境对玻璃微加工技术的限制.

关 键 词:微流控芯片  湿法刻蚀  键合
文章编号:1008-973X(2007)04-0560-04
收稿时间:2006-01-06
修稿时间:2006-01-06

Micro fabrication of micro fluidic glass chip without clean room condition
XIE Hai-bo,FU Xin,YANG Hua-yong. Micro fabrication of micro fluidic glass chip without clean room condition[J]. Journal of Zhejiang University(Engineering Science), 2007, 41(4): 560-563
Authors:XIE Hai-bo  FU Xin  YANG Hua-yong
Affiliation:State Key Laboratory of Fluid Power Transmission and Control, Zhejiang University, Hangzhou 310027, China
Abstract:A micro fabrication process for micro fluidic glass chip was proposed to shake off the dependence of glass chip fabrication process on special technological equipment. The process mainly includes glass wet etching and thermal bonding. A series of comparable experiments on glass wet etching were carried out to observe the effects with different etching solutions and mixture ratios on the etching results. The research was mainly for two typical applications, high etching rate for deep etching and high surface quality for capillary channels. In thermal bonding process, surface affinity treatment, vacuum pro-bonding and bonding temperature control were studied experimentally without clean room condition. The new process provides basic schemes and empirical curves of fabrication of microfluidic glass chip for chemistry and biomedicine.
Keywords:micro fluidic chip   wet etching   bonding
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