| 提高挂镀锡镀层的均匀度 |
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| 引用本文： | 韦右月.提高挂镀锡镀层的均匀度[J].电镀与精饰,2007,29(5):35-37. |
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| 作者姓名： | 韦右月 |
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| 作者单位： | 汕头华汕电子器件有限公司,广东,汕头,515041 |
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| 摘 要： | 通过改善阴极与阳极导电能力,镀液的主要成分在辅槽配制分多次少量添加,最好用自动添加装置加入添加剂,镀液温度要均匀,且搅拌均匀,使用屏蔽板等措施提高了集成电路引线框架镀锡层的均匀度。并使稳定过程能力指数值达到1.33以上。提出了提高IC引线框架挂镀锡的稳定过程能力指数值的措施。
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| 关 键 词： | 电镀锡 主盐 添加剂 镀层均匀度 |
| 文章编号： | 1001-3849（2007）05-0035-03 |
| 收稿时间： | 2006-10-24 |
| 修稿时间： | 2006年10月24日 |
Improving Coating Thickness Uniformity of Tin Rack Plating |
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| WEI You-yue.Improving Coating Thickness Uniformity of Tin Rack Plating[J].Plating & Finishing,2007,29(5):35-37. |
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| Authors: | WEI You-yue |
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| Affiliation: | Shantou Huashan Electronic Devices Co. Ltd. , Shantou 515041, China |
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| Abstract: | Uniformity of tin coating thickness on IC lead frame was improved through the improvements of cathodic conductive ability and anodic conductive ability and measures of replenishing bath main components conducting in an auxiliary tank and in many times and small amount,additives being added in the auxiliary tank with an automatic feeding equipment,even bath temperature and even bath agitation being insured,employing screen plate etc.The CPK value of the process was up to 1.33.Measures for increasing the CPK value of the IC lead frame tin rack plating process were proposed. |
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| Keywords: | tin electroplating main salt additive coating thickness uniformity |
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