应用于柔性电子领域的激光剥离技术进展

柔性电子是可穿戴设备、物联网等应用发展的重要研究方向。激光剥离技术是一种利用激光能量来分离玻璃基板与柔性衬底的技术，具有作用光波长可选、作用时间短、热影响区域小的优点，是目前实现柔性电子器件的最重要技术之一。介绍了激光剥离的主要技术特点，分析其在不同的柔性电子领域的应用，讨论了应用过程中的主要工艺和作用，并总结了激光剥离技术未来的发展趋势。激光剥离技术的快速发展，会对柔性电子行业的研究和发展形成强力支持。

Development of laser lift-off technology used in the field of flexible electronics

Flexible electronic is an important research direction for the development of wearable equipment, internet of things and other applications. Laser lift-off technique is a technology to separate glass substrates from flexible substrates, and one of the important technologies to realize flexible electronic devices at present with advantages of optional light wavelength, short action time, and small heat effect areas.In this paper, the main technical characteristics of laser lift-off were introduced, its application in different flexible electronic fields was analyzed, the main processes and functions in the application process were discussed. Finally, the future development trend of laser lift-off technology was summarized.The rapid development of laser lift-off technologywill form a strong support for the research and development of flexible electronics industry.