| 密封封装内部水汽含量判据研究 |
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| 引用本文： | 杨晨,张素娟.密封封装内部水汽含量判据研究[J].电子产品可靠性与环境试验,2010,28(5):18-22. |
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| 作者姓名： | 杨晨 张素娟 |
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| 作者单位： | 北京航空航天大学可靠性与系统工程学院,北京,100191 |
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| 摘 要： | 密封封装内部的水汽对于半导体器件的可靠性是一种威胁,由此导致的硅表面铝金属线的腐蚀是一种主要的失效机理。为了防止密封封装内部发生腐蚀失效,从而提高器件的可靠性,美军标和我国国军标均给出了内部水汽含量的试验流程和判据。然而另一些研究表明,水汽的单独存在并不会导致铝线腐蚀失效。研究了水汽在密封器件的腐蚀失效机理中的作用,对硅表面铝线的腐蚀过程进行了数学描述,分析了目前标准中内部水汽含量判据,并给出了防止密封器件腐蚀失效的建议。
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| 关 键 词： | 密封封装 内部水汽含量 腐蚀 失效机理 集成电路可靠性 |
Research on the Criteria of Internal Moisture Content in Hermetic Packages |
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| YANG Chen,ZHANG Su-juan.Research on the Criteria of Internal Moisture Content in Hermetic Packages[J].Electronic Product Reliability and Environmental Testing,2010,28(5):18-22. |
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| Authors: | YANG Chen ZHANG Su-juan |
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| Affiliation: | YANG Chen,ZHANG Su-juan(School of Reliability and Systems Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100191,China) |
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| Abstract: | The internal moisture in hermetic packages is hazardous to the reliability of semiconductor devices,and the corrosion of the aluminum metal traces on the silicon surface caused by the moisture is the main failure mechanism.To prevent the corrosion failure in hermetic packages and improve the reliability of semiconductor devices,the test procedure and criteria for the internal moisture content were presented in both the military standards of the USA and China.But other researches indicated that the moisture ... |
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| Keywords: | hermetic package internal moisture content corrosion failure mechanism IC reliability |
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