| 有机硅/环氧树脂耐高温封装胶的制备 |
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| 引用本文： | 裴昌龙,陈清,钟桂云,陶杰,邵均林.有机硅/环氧树脂耐高温封装胶的制备[J].化工新型材料,2012,40(1):134-136. |
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| 作者姓名： | 裴昌龙 陈清 钟桂云 陶杰 邵均林 |
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| 作者单位： | 浙江省化工研究院有限公司,杭州,310023 |
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| 摘 要： | 以γ-缩水甘油醚氧丙基三甲氧基硅烷为原料,通过水解缩聚制备出有机硅树脂,并与环氧树脂杂化,使用间苯二胺/聚酰胺作为固化剂。研究结果表明:当环氧树脂与有机硅树脂的质量比为7∶3,固化剂用量为16%时,所制备封装胶的剪切强度为17.23MPa,硬度为37.2N/mm2,与单纯的环氧树脂相比,合成的有机硅树脂能提高胶的热分解温度,表明该导热封装胶的综合性能得到提高。
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| 关 键 词： | 有机硅树脂 胶粘剂 剪切强度 |
Heat resistance epoxy/organosilicon packaging adhesive |
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| Pei Changlong
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Chen Qing
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Zhong Guiyun
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Tao Jie
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Shao Junlin.Heat resistance epoxy/organosilicon packaging adhesive[J].New Chemical Materials,2012,40(1):134-136. |
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| Authors: | Pei Changlong Chen Qing Zhong Guiyun Tao Jie Shao Junlin |
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| Affiliation: | Pei Changlong Chen Qing Zhong Guiyun Tao Jie Shao Junlin(Zhejiang Chemical Industry Research Institute,Hangzhou 310023) |
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| Abstract: | Organosilicon resin was synthesized from γ-(glycidoxypropyl) trimethoxysilane(KH-560) through the hydrolytic polycondensation,Then organosilicon/epoxy adhesive was cured by metaphenylene diamine/polyamide.It was found that when molar ratio of epoxy resin to organosilicon resin was 7:3,mass ratio of curing agent was 16%,adhesive strength was 17.23 MPa,hardness was 37.2 N/mm2,thermal decomposition temperature of organosilicon/epoxy adhesive was higher than cured product of epoxy resin.It can be concluded that this adhesive had better combination properties. |
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| Keywords: | organosilicon resin packaging adhesive shear strength |
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