| Evaluation of Young''''s Modulus and Residual Stress of NiFe Film by Microbridge Testing |
| |
| 引用本文： | Zhimin ZHOU,Yong ZHOU,Mingjun WANG,Chunsheng YANG,Ji''''an CHEN,Wen DING,Xiaoyu GAO and Taihua ZHANG Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education,Research Institute of Micro/Nanometer Science and Technology,Shanghai Jiao Tong University,Shanghai 200030,China State Key Laboratory of Nonlinear Mechanics (LNM),Institute of Mechanics,Chinese Academy of Sciences,Beijing 100080,China. Evaluation of Young''''s Modulus and Residual Stress of NiFe Film by Microbridge Testing[J]. 材料科学技术学报, 2006, 22(3) |
| |
| 作者姓名： | Zhimin ZHOU Yong ZHOU Mingjun WANG Chunsheng YANG Ji''''an CHEN Wen DING Xiaoyu GAO and Taihua ZHANG Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education Research Institute of Micro/Nanometer Science and Technology Shanghai Jiao Tong University Shanghai 200030 China State Key Laboratory of Nonlinear Mechanics (LNM) Institute of Mechanics Chinese Academy of Sciences Beijing 100080 China |
| |
| 基金项目： | Key Fundamental Research and Development Program，中国科学院资助项目，Nanometer Technology Program of Science and Technology Committee of Shanghai，中国博士后科学基金，Doctoral Training Foundation of National Education Commission of China |
| |
| 摘 要： | Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young's modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MPa, respectively, while the Young's modulus measured by the Nano-hardness method is 209.6±11.8 GPa for the thick NiFe film with silicon substrate.
|
Evaluation of Young''''s Modulus and Residual Stress of NiFe Film by Microbridge Testing |
| |
| Zhimin ZHOU,Yong ZHOU,Mingjun WANG,Chunsheng YANG,Ji''''an CHEN,Wen DING,Xiaoyu GAO,Taihua ZHANG. Evaluation of Young''''s Modulus and Residual Stress of NiFe Film by Microbridge Testing[J]. Journal of Materials Science & Technology, 2006, 22(3) |
| |
| Authors: | Zhimin ZHOU Yong ZHOU Mingjun WANG Chunsheng YANG Ji''''an CHEN Wen DING Xiaoyu GAO Taihua ZHANG |
| |
| Abstract: | Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young's modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MPa, respectively, while the Young's modulus measured by the Nano-hardness method is 209.6±11.8 GPa for the thick NiFe film with silicon substrate. |
| |
| Keywords: | Mechanical properties Metal thin film Nanoindentation |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
