| PBGA焊接开裂失效原因分析及改善 |
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| 引用本文： | 刘冬,周刚. PBGA焊接开裂失效原因分析及改善[J]. 印制电路信息, 2010, 0(8): 63-66 |
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| 作者姓名： | 刘冬 周刚 |
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| 作者单位： | 惠州中京电子科技股份有限公司,广东,惠州516008 |
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| 摘 要： | 由于PBGA组件点位于四件与PCB之间,焊点的检查和检修成本很高,控制PCB组件焊接失效显得尤为重要。文章通过对焊接失效的焊盘镍层、金层结构进行了SEM、X-RAY分析导致焊接失效产生的主要原因,并针对此现象进行控制与改善。
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| 关 键 词： | 塑封球面阵列 富磷层 开裂 |
PBGA Welding Crack Failure Analysis and Improvement |
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| LIU Dong,ZHOU Gang. PBGA Welding Crack Failure Analysis and Improvement[J]. Printed Circuit Information, 2010, 0(8): 63-66 |
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| Authors: | LIU Dong ZHOU Gang |
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| Affiliation: | LIU Dong ZHOU Gang |
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| Abstract: | Because PBGA module is located between four parts components and PCB, the solder joints check and repair cost is high, therefore the control of PCB assembly welding failure appears particularly important. Based on the failure of welding plate nickel layer, gold layer structure SEM, X-RAY in welding failure analysis of the main reasons for this phenomenon, the author proposed improvement and control method. |
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| Keywords: | PBGA rich phosphate layer crack |
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