Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging |
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| Authors: | Kyoung-sik Moon CP Wong Soo-hyung Kim Hyung Do Choi Seung Han Ho Gyu Yoon Kwang S Suh |
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| Affiliation: | (1) School of Materials Science & Engineering, Packaging Research Center, Georgia Institute of Technology, 771 Ferst Dr. NW, Atlanta, GA 30332-0245, USA;(2) System LSI Team, Semiconductor Business, Samsung Electronics Co. Ltd, Kiheung-Eup, Yongin-Gun, Kyungki-Do, 449-900, Korea;(3) EMC Center, Korea Radio Promotion Association, Kyungki-Do, 430-082, Korea;(4) Engineering & Construction, Hyundai Development Company, #160 Sam Sung Dong, Kang Nam-gu, Seoul, 135-881, Korea;(5) Department of Materials Science, Korea University, Seoul, 136-701, Korea |
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| Abstract: | The complex permittivity and permeability of ferrite-filled polymer composites were studied at 50 MHz to 1 GHz, and their
effects on the electromagnetic compatibility (EMC) of an integrated circuit (IC) package mounted on a printed wiring board
(PWB) in the far- and near-field modes were investigated. Incorporating the ferrite particles into the polymer increased the
real part of the complex permeability to 10–11 at 50 MHz, and the real part exhibited a frequency dependency over the applied
frequency range (50 MHz to 1 GHz). The ferrite particle increased the magnetic loss (μ″ = 3–5) as well, which can absorb the magnetic energy of the incident electromagnetic wave. By coating the test IC package
with the ferrite-polymer composite materials, the EMC level of the PWB was dramatically improved. This improvement may be
due to the high magnetic loss of the ferrite-polymer composite. |
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| Keywords: | Ferrite polymer composite electromagnetic absorber electronic package EMC EMI EMS GTEM |
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