粉末冶金W/Re合金靶材的显微结构及磁控溅射沉积性能

为了研制高品质W/Re合金靶材,采用机械混料、压制成形和真空烧结致密化工艺路线制备了纯钨及铼含量分别为1％、5％、10％(质量分数)的钨/铼(W/Re)合金,测试了W/Re合金的致密度、晶粒度及晶粒取向、磁控溅射沉积等性能.研究表明,W/Re合金致密度及纯度均随Re含量增加而逐渐提高,而晶粒逐渐细化.W/10％Re合金...

Microstructure and magnetron sputtering properties of W/Re alloy targets fabricated by powder metallurgy

In order to development high quality W/Re alloy targets,pure W and W/Re alloy(with 1 wt%,5 wt%and 10 wt%Re)were fabricated by mechanical mixing,press forming and vacuum sintering.Properties such as relative density,grain size and direction,magnetron sputtering of W/Re alloy were investigated.The results show that both relative density and purity of W/Re alloy increase with the increase of the Re content.In addition,grain size decreases with Re addition.And grain size of W/10 wt%Re alloy target is mainly distributed between 10 and 40μm.The grain size of W/Re alloy is randomly distributed without preferred orientation.And content of small angle grain boundary(<10°)of W/10 wt%Re alloy is more than 85%.The grain size of W/Re alloy thin film is gradually refined as deposition pressure of magnetron sputtering increases.Meanwhile,both surface flatness and thickness of thin film are gradually increased.XRD spectra of thin films show that(110),(200)and(211)diffraction peaks appear near 40.5°,58.6°and 73.5°,respectively.As the deposition pressure increases,the intensity of(110)diffraction peaks decreases gradually,while that of(200)diffraction peaks increases gradually.However,perfect thin film is impossibly prepared by magnetron sputtering from pure W target for its low density and purity with large grain size.