| 生极板的固化控制与机理分析 |
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| 引用本文： | 李昌镞. 生极板的固化控制与机理分析[J]. 蓄电池, 2002, 39(4): 170-173 |
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| 作者姓名： | 李昌镞 |
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| 作者单位： | 安溪闽华电池有限公司,福建,安溪,362400 |
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| 摘 要： | 简述了我厂大批量生极板的固化工艺 ,并对不同阶段的固化过程数据进行较详细分析与机理分析 ,同时指明只有综合考虑游离铅含量、板栅表面的腐蚀程度、碱式硫酸铅的再结晶程度等各方面因素 ,才能全面判断固化的程度。
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| 关 键 词： | 固化 铅膏含水量 游离铅 |
| 文章编号： | 1006-0847(2002)04-0170-04 |
| 修稿时间： | 2002-09-14 |
Analysis of mechanism and control of plate curing |
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| LI Chang zu. Analysis of mechanism and control of plate curing[J]. Chinese Labat Man, 2002, 39(4): 170-173 |
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| Authors: | LI Chang zu |
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| Abstract: | The curing process of large quantity of green plates at our factory was briefly introduced and the process data at different curing stages were discussed in detail,and an analysis of the curing mechanism was also made.The practice indicated that a comprehensive judgement on the curing degree could not be formed until an integration of the following factors had been taken into consideration,i.e.the content of free lead,corrosion degree of grid surface and the recrystalization of basic lead sulfate. |
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| Keywords: | curing water content in paste free lead |
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